Sunday
Aug282011

New Products

Casting Applications

Polyurea - ESK PU2 A/B + PU Flex

High Toughness, Abrasion and Impact Resistance. 

Offers a very versatile system in terms of processing and simple modification to cure speed and flexibility of the end product.

Typical Applications – Rapid production of tough, durable castings, typically for assembly jigs, percussion tools, foundry patterns, prototypes, machinery parts and low volume production items.

  • Cure Speed – Simple modification to the cure speed can be made by blending with PU1. Gellation can be adjusted from 60 second gel to 10 minutes complimenting machine or hand processing.

  • ESK PU2 A/B (Shore D 70) offers a very resilient, tough, abrasion and impact resistant cured product which can be cast by hand or via MMD equipment in ERP, GRP, Silicone or metal tooling.

  • Flexibility can be modified by the addition of PU Flex which enables a comprehensive range of products ranging from D70 to A30 can be achieved.

  • Possible to add pigment or dye to achieve a preferred colour.

General Casting – Moulds and Vacuum Form Tools

ESK CR1 Resin + Hardeners ESK CR1S (Slow) and or ESK CR1 F (Fast)

  • Grey, mineral filled Casting System

  • Good machining properties

  • Temperature resistance up to 100C

  • Variable pot life with optional slow and fast hardeners (or combination of).

  • Suitability for casting in layers up to 150mm. in a single operation using the slow hardener.

Laminating & Infusion Systems

Flexible Epoxy System - ESK LV4 Resin + ESK H4

Resilient laminated moulds where a greater degree of flexing in the mould or component is of benefit compared to many traditional tooling epoxy resins and hardeners.

  • Resilient moulds where a greater degree of flexing in the mould or component is desirable.

  • Suitable for infusion and wet lay up.

  • Room Temperature curing.

Toughened Epoxy System – ESK T + ESK H4 or LVH2

  • Suitable for adhesive and wet laminating applications

  • High degree of toughness

  • Long pot life

  • Room Temperature or elevated cure options by choice of hardener ESK H4 or ESK LVH2

 ESK DP1000 + ESKH4 or ESK LVH2

 Toughened Epoxy System with Lower Viscosity

  • High degree of toughness

  • Suitable for Infusion and wet Laminating applications.

  • Unfilled system so particle filtration is not an issue

  • Room Temperature and elevated cure options by choice of hardener ESK H4 or ESK LVH2

Adhesive Systems

Toughened Epoxy System – ESK T + ESK H4 or LVH2

  • Suitable for adhesive and wet laminating applications

  • High degree of toughness

  • Long pot life

  • Room Temperature or elevated cure options by choice of hardener ESK H4 or ESK LVH2

 Hardener ESK H3 could be considered for room temperature applications where poor surface preparation or moisture is likely to be an issue.

If you have a specific requirement, end application or process and unable to find what you require please do not hesitate to give us a call. We work closely with our partners/clients to offer a very responsive, proactive & cost effective solution.

All products are REACH compliant and manufactured to ISO 9001



Monday
Jan312011

JEC Composites Show Paris 2011

GNP Technology will be attending the JEC Composites show 2011 on the 29th and 30th March.

If you wish to arrange a meeting or individual consultation during the event then please contact us.

Monday
Jan312011

What's new for 2011?

 

Since GNP Technology was established last year there were two key priorities set, firstly to give a prompt technical support service by long served and trained experienced staff and secondly to develop niche products which we feel are innovative and will be of benefit to our customers and the composites market as a whole. With this vision in mind we set out to improve our service and portfolio.

 

Technical Support

Due to customer demand we now offer an out of office telephone service for those clients who like the peace of mind and convenience of having technical support available during and outside normal office hours.

 

New Products Summary

ESK LV1 (Multifunctional) and ESK LV2 are very low viscosity epoxy resins for cold or warm curing systems

  • Exceptionally low viscosity compared to conventional epoxy resins ~ 270mPas.
  • Improved infusion and wetting of speciality fibres in composite materials
  • Improved curing with amine hardeners at moderate temperatures without use of accelerators
  • Hardener ESK LV-H is a very low viscosity amine hardener for combination with ESK LV1
  • and ESK LV2

 

ESK B16 is a liquid accelerator for anhydride cured epoxy resins.

  • Much reduced shrinkage during cure compared to imidazoles or Mannich base accelerators.
  • Can be used as sole accelerator or in combination with traditional accelerators.

 

ESK LC1 and ESK LC2 are liquid hardeners for use in conjunction with epoxy resins: 

Offered for the manufacture of B-staged pre-impregnated speciality clothes and fibres. (B-stage is defined as partial cure to a high viscosity or solid state which can be fused and cured later as required).

  • Liquid curatives which make for simple processing.
  • Can be combined with conventional liquid bisphenol A epoxy resins.
  • Stable B-Stage in solid or semi-solid forms which can be melted and cured as required.
  • Avoidance of handling solid hardener and enabling minimal heat to be used during processing. Need for heating will be dependent on the type of resin used in the formulation but with BLR in theory it is not necessary to heat above 20-25 Celsius at the mixing or impregnation stages.
  • Hot melt type system,no solvent required.
  • B-Stage can be achieved at ambient temperature or elevated temperatures on the prepregger.

If any of these new products or services interest you, please do not hesitate to contact us for more information.

 



Sunday
Sep192010

GNP Technology Site Launched

Welcome to GNP Technology.

This marks the launch of our new website.

Please do not hesitate to contact us if you are interested in the services and expertise we offer.

Thank you for your interest in GNP Technology.

Page 1 2